• DocumentCode
    2180751
  • Title

    An Efficient 3D-to-2D Reduction Technique for Frequency-Domain Layered Finite Element Analysis of Large-Scale High-Frequency Integrated Circuits

  • Author

    Sheng, Feng ; Chakravarty, Sourav ; Jiao, Dan

  • Author_Institution
    Purdue Univ., West Lafayette
  • fYear
    2007
  • fDate
    29-31 Oct. 2007
  • Firstpage
    295
  • Lastpage
    298
  • Abstract
    This paper proposes an efficient technique for reducing a 3D layered system matrix to a 2D layered one in the framework of the frequency-domain layered finite element method. This technique is capable of solving the volume-unknown based matrix equation in linear complexity, and hence reducing the complexity of 3D-to-2D reduction from O(M3) to O(M2), with M being the number of top/bottom surface unknowns in a single layer. The numerical procedure is rigorous without making any approximation. The technique applies to any arbitrarily-shaped multilayer IC problem. Numerical and experimental results have demonstrated its accuracy and efficiency.
  • Keywords
    computational complexity; finite element analysis; integrated circuit design; matrix algebra; 2D layered system matrix; 3D layered system matrix; frequency-domain layered finite element analysis; high-frequency integrated circuits; linear complexity; matrix equation; Costs; Electromagnetic analysis; Electromagnetic modeling; Finite element methods; Frequency domain analysis; Large scale integration; Large-scale systems; Nonhomogeneous media; Photonic integrated circuits; Sparse matrices; On-chip; electromagnetic modeling; frequency domain; large-scale;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2007 IEEE
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    978-1-4244-0883-2
  • Type

    conf

  • DOI
    10.1109/EPEP.2007.4387185
  • Filename
    4387185