DocumentCode
2180751
Title
An Efficient 3D-to-2D Reduction Technique for Frequency-Domain Layered Finite Element Analysis of Large-Scale High-Frequency Integrated Circuits
Author
Sheng, Feng ; Chakravarty, Sourav ; Jiao, Dan
Author_Institution
Purdue Univ., West Lafayette
fYear
2007
fDate
29-31 Oct. 2007
Firstpage
295
Lastpage
298
Abstract
This paper proposes an efficient technique for reducing a 3D layered system matrix to a 2D layered one in the framework of the frequency-domain layered finite element method. This technique is capable of solving the volume-unknown based matrix equation in linear complexity, and hence reducing the complexity of 3D-to-2D reduction from O(M3) to O(M2), with M being the number of top/bottom surface unknowns in a single layer. The numerical procedure is rigorous without making any approximation. The technique applies to any arbitrarily-shaped multilayer IC problem. Numerical and experimental results have demonstrated its accuracy and efficiency.
Keywords
computational complexity; finite element analysis; integrated circuit design; matrix algebra; 2D layered system matrix; 3D layered system matrix; frequency-domain layered finite element analysis; high-frequency integrated circuits; linear complexity; matrix equation; Costs; Electromagnetic analysis; Electromagnetic modeling; Finite element methods; Frequency domain analysis; Large scale integration; Large-scale systems; Nonhomogeneous media; Photonic integrated circuits; Sparse matrices; On-chip; electromagnetic modeling; frequency domain; large-scale;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2007 IEEE
Conference_Location
Atlanta, GA
Print_ISBN
978-1-4244-0883-2
Type
conf
DOI
10.1109/EPEP.2007.4387185
Filename
4387185
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