Investigation of interconnect capacitance characterization using charge-based capacitance measurement (CBCM) technique and 3-D simulation

This paper examines the recently introduced Charge-Based Capacitance Measurement (CBCM) technique through use of a 3-D interconnect simulator. This method is shown to have several advantages over extensive computer simulation in determining parasitic interconnect capacitances, which are the dominant source of delay in modern circuits. Metal to substrate, interwire, and interlayer capacitances are each discussed and overall close agreement is found between CBCM and 3-D simulation. Full process interconnect characterization is one possible application of this new compact, high-resolution test structure