DocumentCode :
2180967
Title :
Fast EMC Analysis of High-Speed Interconnects via Waveform Relaxation and Transverse Partitioning
Author :
Sridhar, Arvind ; Nakhla, Natalie ; Achar, Ram ; Nakhla, Michel
Author_Institution :
Carleton Univ., Ottawa
fYear :
2007
fDate :
29-31 Oct. 2007
Firstpage :
329
Lastpage :
332
Abstract :
This paper presents an efficient method for simulating a large number of coupled interconnects in the presence of electromagnetic interference. The algorithm is based on transverse partitioning and waveform relaxation techniques. The computational cost of the proposed algorithm increases only linearly with the number of lines compared to the more than cubic growth in conventional methods. In addition, the algorithm gives leads to parallel implementation providing further savings in computational cost.
Keywords :
electromagnetic compatibility; electromagnetic interference; integrated circuit interconnections; iterative methods; EMC analysis; coupled interconnects simulation; electromagnetic interference; high-speed interconnects; transverse partitioning; waveform relaxation; Analytical models; Circuit simulation; Computational efficiency; Computational modeling; Coupling circuits; Electromagnetic compatibility; Electromagnetic coupling; Electromagnetic interference; Integrated circuit interconnections; Partitioning algorithms;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2007 IEEE
Conference_Location :
Atlanta, GA
Print_ISBN :
978-1-4244-0883-2
Type :
conf
DOI :
10.1109/EPEP.2007.4387194
Filename :
4387194
Link To Document :
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