Title :
The effect of polyethylene glycols upon copper electrodeposition in methanesulfonate electrolytes
Author :
Ji, Chunhua ; Ling, Huiqin ; Li, Ming ; Mao, Dali
Author_Institution :
Shanghai Jiao Tong Univ., Shanghai, China
Abstract :
The effect of polyethylene glycols upon copper electrodeposition in methanesulfonate electrolytes is discussed in this paper. By means of linear sweep voltammetry and electrochemical impedance spectroscopy, it is found that polyethylene glycols in methanesulfonat electrolytes have very different behavior from that in traditional sulfuric electrolytes. PEG can adsorb on electrode surface in absent of chloride ion. The presence of chloride would destroy PEG adsorption to the electrode surface. The impedance shows that PEG can inhibit the reactions Cu2+→Cu+ and Cu+→Cu. The special effect of PEG in methanesulfonate electrolyte is probably related to methanesulfonic radical.
Keywords :
copper; electrochemical impedance spectroscopy; electrodeposition; electrolytes; voltammetry (chemical analysis); Cu; electrochemical impedance spectroscopy; electrode surface; electrodeposition; linear sweep voltammetry; methanesulfonate electrolytes; polyethylene glycols; sulfuric electrolytes; Copper; Electrodes; Impedance; Resistance; Surface impedance; Surface treatment; Through-silicon vias;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066787
