The effect of polyethylene glycols upon copper electrodeposition in methanesulfonate electrolytes

Author

Ji, Chunhua ; Ling, Huiqin ; Li, Ming ; Mao, Dali

Author_Institution

Shanghai Jiao Tong Univ., Shanghai, China

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

4

Abstract

The effect of polyethylene glycols upon copper electrodeposition in methanesulfonate electrolytes is discussed in this paper. By means of linear sweep voltammetry and electrochemical impedance spectroscopy, it is found that polyethylene glycols in methanesulfonat electrolytes have very different behavior from that in traditional sulfuric electrolytes. PEG can adsorb on electrode surface in absent of chloride ion. The presence of chloride would destroy PEG adsorption to the electrode surface. The impedance shows that PEG can inhibit the reactions Cu2+→Cu+ and Cu+→Cu. The special effect of PEG in methanesulfonate electrolyte is probably related to methanesulfonic radical.

Keywords

copper; electrochemical impedance spectroscopy; electrodeposition; electrolytes; voltammetry (chemical analysis); Cu; electrochemical impedance spectroscopy; electrode surface; electrodeposition; linear sweep voltammetry; methanesulfonate electrolytes; polyethylene glycols; sulfuric electrolytes; Copper; Electrodes; Impedance; Resistance; Surface impedance; Surface treatment; Through-silicon vias;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066787

Filename

6066787