• DocumentCode
    2182234
  • Title

    Integrated antennas for RF sensing, wireless communications and energy harvesting applications

  • Author

    Russer, Peter ; Russer, Johannes A. ; Mukhtar, Farooq ; Lugli, Paolo ; Wane, S. ; Bajon, D. ; Porod, Wolfgang

  • Author_Institution
    Inst. for Nanoelectron., Tech. Univ. Munchen, Garching, Germany
  • fYear
    2013
  • fDate
    4-6 March 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Silicon-based monolithic integrated millimeterwave circuits today facilitate the realization of millimeterwave communication and sensing systems [1], [2]. Monolithic integration of antennas into transmitter and receiver front ends reduces weight and costs of millimeterwave systems [3]. As the structure size of circuit devices and components is continuously decreasing the same will hold true for antennas and radiation elements used in integrated circuits for on-chip and chip-to-chip communication. An interesting option to overcome the bandwidth limitations for signal transmission on or between monolithic integrated circuits is wireless chip-to-chip and on-chip interconnects via integrated antennas. Instead of dedicating chip area for the antenna, the antenna can make use of the available on-chip metallization. Antenna-coupled thermal sensors offer a unique choice for infrared detection applications. A considerable size reduction of integrated antenna structures may be achieved using carbon nanotubes and graphene as the antenna material. Plasmonic nanostructures allow realizing ultra small antenna structures for detection applications.
  • Keywords
    MMIC; antenna radiation patterns; carbon nanotubes; elemental semiconductors; energy harvesting; infrared detectors; integrated circuit interconnections; silicon; RF sensing; antenna material; antenna monolithic integration; antenna-coupled thermal sensors; bandwidth limitations; carbon nanotubes; chip-to-chip communication; circuit device structure size; component structure size; graphene; infrared detection applications; integrated antenna structure size reduction; integrated antennas; millimeterwave communication; millimeterwave system cost reduction; millimeterwave system weight reduction; on-chip communication; on-chip metallization; plasmonic nanostructures; radiation elements; receiver front end; signal transmission; silicon-based monolithic integrated millimeterwave circuits; transmitter front end; wireless chip-to-chip interconnects; wireless communications; wireless on-chip interconnects; Antenna measurements; Dipole antennas; Graphene; Integrated circuit modeling; Wireless communication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antenna Technology (iWAT), 2013 International Workshop on
  • Conference_Location
    Karlsruhe
  • Print_ISBN
    978-1-4673-2830-2
  • Electronic_ISBN
    978-1-4673-2829-6
  • Type

    conf

  • DOI
    10.1109/IWAT.2013.6518285
  • Filename
    6518285