DocumentCode
2182347
Title
Solder paste in SMT: a training perspective
Author
Peck, Douglas J.
Author_Institution
Adv. Electron. Interconnect Inc., USA
fYear
1998
fDate
9-11 Jun 1998
Firstpage
1
Lastpage
14
Abstract
An effective stencil printing operation is essential for quality SMT assembly. This can be achieved only by thorough operator training in all aspects of the printing process. The operator must have a working knowledge of solder paste, paste quality testing, and handling. He/she must understand all aspects of printer setup, and the effects of setup deficiencies. Postprint inspection by the operator is critical in verifying print quality, as is maintenance of effective SPC monitoring
Keywords
assembling; inspection; printed circuit manufacture; printing; quality control; soldering; statistical process control; surface mount technology; training; SMT; SPC monitoring; operator training; paste handling; paste quality testing; postprint inspection; print quality; printer setup; printing process; setup deficiencies; solder paste; stencil printing operation; training perspective; Assembly systems; Cleaning; Fabrication; Inspection; Ovens; Powders; Printers; Printing; Surface-mount technology; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electro 98. Professional Program Proceedings
Conference_Location
Boston, MA
Print_ISBN
0-7803-4940-7
Type
conf
DOI
10.1109/ELECTR.1998.682101
Filename
682101
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