DocumentCode :
2182458
Title :
Development process of phosphor coating with screen printing for white LED packaging
Author :
Yu, Shan ; Yang, Liang ; Bin, Cao ; Zheng, Huai ; Chen, Mingxiang ; Liu, Sheng
Author_Institution :
Sch. of Mech. Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear :
2011
fDate :
8-11 Aug. 2011
Firstpage :
1
Lastpage :
5
Abstract :
An improved screen printing technology for the coating of a cerium-doped yttrium aluminum garnet (YAG): Ce3+ yellow phosphor on blue light emitting diodes (LEDs) is presented. A metal plate with apertures matches with wire-bonded LED chips on a substrate. Silicone with YAG: Ce3+ phosphor is pushed into the apertures by a squeegee blade and then the metal plate is removed by release agent after curing. The thickness of phosphor layer is controlled by the thickness of metal mask and the phosphor concentration on luminescence emission and chromaticity are investigated. In order to obtain uniform coating and an optimized geometry of the phosphor layer on the surface of LED chip, this approach is optimized to manufacture and provide a wide range of color temperature.
Keywords :
cerium; curing; lead bonding; light emitting diodes; luminescence; phosphors; yttrium compounds; YAG:Ce; blue light emitting diodes; chromaticity; curing; luminescence emission; metal plate; phosphor coating; phosphor concentration; release agent; screen printing; squeegee blade; white LED packaging; wire bonded LED chips; Coatings; Image color analysis; Light emitting diodes; Metals; Packaging; Phosphors; Printing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
Type :
conf
DOI :
10.1109/ICEPT.2011.6066799
Filename :
6066799
Link To Document :
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