Title :
The flip chip market and supply chain are being reshaped by new requirements and technologies
Author :
Cadix, Lionel ; Yannou, Jean-Marc ; Zinc, Christophe
Author_Institution :
Yole Dev., Lyon, France
Abstract :
Flip chip technology certainly isn´t new, but it´s not considered mature yet either. It was originally created by IBM in the 1960s and, due to its high cost, has been primarily reserved for high-performance applications. Until relatively recently, nearly all packages relied on wire bonding. Now, flip chips are taking over.
Keywords :
IBM computers; flip-chip devices; lead bonding; IBM; flip chip market; flip chips; supply chain; wire bonding; Bonding; Flip chip; Integrated circuit interconnections; Packaging; Supply chains; Wires;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066809
