• DocumentCode
    2182907
  • Title

    PQFP moisture bake out process optimization

  • Author

    Nguyen, Lb ; Atlas, Gary

  • Author_Institution
    Digital Equipment Corp., USA
  • fYear
    1998
  • fDate
    9-11 Jun 1998
  • Firstpage
    21
  • Lastpage
    35
  • Abstract
    PQFP packages, prior to board assembly, have a requirement to be “baked out” of absorbed moisture to prevent “pop corning”. This paper identifies key factors that are necessary for controlling an efficient and optimized bake out process. Moisture absorption and desorption of the PQFP package is discussed. Methods are recommended for optimizing and verifying the performance of the bake out ovens
  • Keywords
    desorption; integrated circuit packaging; moisture; ovens; plastic packaging; PQFP; absorbed moisture; desorption; moisture bake out process; ovens; pop corning; process optimization; Absorption; Assembly; Manufacturing industries; Moisture control; Optimization methods; Ovens; Plastic packaging; Safety; Temperature control; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electro 98. Professional Program Proceedings
  • Conference_Location
    Boston, MA
  • Print_ISBN
    0-7803-4940-7
  • Type

    conf

  • DOI
    10.1109/ELECTR.1998.682103
  • Filename
    682103
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2182907