Title :
PQFP moisture bake out process optimization
Author :
Nguyen, Lb ; Atlas, Gary
Author_Institution :
Digital Equipment Corp., USA
Abstract :
PQFP packages, prior to board assembly, have a requirement to be “baked out” of absorbed moisture to prevent “pop corning”. This paper identifies key factors that are necessary for controlling an efficient and optimized bake out process. Moisture absorption and desorption of the PQFP package is discussed. Methods are recommended for optimizing and verifying the performance of the bake out ovens
Keywords :
desorption; integrated circuit packaging; moisture; ovens; plastic packaging; PQFP; absorbed moisture; desorption; moisture bake out process; ovens; pop corning; process optimization; Absorption; Assembly; Manufacturing industries; Moisture control; Optimization methods; Ovens; Plastic packaging; Safety; Temperature control; Wiring;
Conference_Titel :
Electro 98. Professional Program Proceedings
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-4940-7
DOI :
10.1109/ELECTR.1998.682103
