Retarding electromigration on the Sn-Ag-Cu solder joints by micro-sized metal-particle reinforcement

Author

Ma, Limin ; Xu, Guangchen ; Guo, Fu ; Wang, Xitao

Author_Institution

Coll. of Mater. Sci. & Eng., Beijing Univ. of Technol., Beijing, China

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

5

Abstract

Electromigration (EM) has become one of the reliability concerns to the fine pitch solder joint due to its increasing capacity to bear the high current density The EM effects on microstructure evolution of Sn-3.0Ag-0.5Cu+XNi (X=0, 0.05, 0.45, 2.0wt. %) solder joint was investigated. Findings of this study indicated that an appropriate addition of Ni element and moderate ambient temperature can alleviate EM damages in solder joint. The intermetallic compound layer which held a planar type and appropriate thickness improved the resistance of EM effects by suppressing the polarity effect. Ag₃Sn and the bulk IMCs also retard the effects from current stressing for the solder joint.

Keywords

copper alloys; current density; electromigration; fine-pitch technology; nickel alloys; silver alloys; solders; tin alloys; EM effects; Ni; Sn-Ag-Cu; current density; electromigration; fine pitch solder joint; intermetallic compound layer; microsized metal-particle reinforcement; polarity effect; Anodes; Cathodes; Copper; Electromigration; Microstructure; Nickel; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066819

Filename

6066819