DocumentCode
2183244
Title
Preparation and properties of conductive polymer doped with Ag-coated glass fiber for EMI shielding
Author
Liu, Xiaohei ; Xia, Zhidong ; Yuan, Bo ; Zhao, Mengke ; Guo, Fu
Author_Institution
Mater. Sci. & Eng., Beijing Univ. of Technol., Beijing, China
fYear
2011
fDate
8-11 Aug. 2011
Firstpage
1
Lastpage
5
Abstract
In this study, based on the conductive polymer filled with Ag-coated Cu dendritic powder (ACDP), Ag-coated glass fiber powder (AGFP) was selected as assistant filler to improve the conductive network. The results showed that the volume resistivity reached 0.004Ω·cm when the total fillers were less than 70.6 wt%. The effect of the filler content of the AGFP powder on the conductivity, creep behavior of resistance and piezo-resistivity properties of the conductive polymer was studied. Under constant pressure, the resistance creep behavior of the conductive polymer showed that the volume resistivity decreased nonlinearly with time. When the pressure was applied within 0-2.0MPa, the conductivity variation of the conductive polymer exhibited a positive pressure coefficient of resistance (PPCR). However, the piezoresistance effect could be neglected with increasing filler content and applied pressure. In addition, the reliability of the conductive polymer under aging at 85°C and 85% relative humidity (RH) in a temperature/humidity chamber was discussed.
Keywords
ageing; conducting polymers; copper; creep; dendrites; electromagnetic interference; electromagnetic shielding; filled polymers; glass fibre reinforced plastics; glass fibres; piezoelectricity; piezoresistance; silver; ACDP; AGFP powder; Ag-Cu-SiO2; EMI shielding; PPCR; assistant filler; conductive polymer reliability; glass fiber; piezoresistance effect; piezoresistivity property; positive pressure coefficient of resistance; pressure 0 MPa to 2.0 MPa; temperature 85 degC; temperature-humidity chamber; volume resistivity; Aging; Conductivity; Copper; Creep; Packaging; Polymers; Resistance; conductive polymer; creep; glass fiber; piezoresistance effect; reliability; volume resistivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4577-1770-3
Electronic_ISBN
978-1-4577-1768-0
Type
conf
DOI
10.1109/ICEPT.2011.6066827
Filename
6066827
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