• DocumentCode
    2183244
  • Title

    Preparation and properties of conductive polymer doped with Ag-coated glass fiber for EMI shielding

  • Author

    Liu, Xiaohei ; Xia, Zhidong ; Yuan, Bo ; Zhao, Mengke ; Guo, Fu

  • Author_Institution
    Mater. Sci. & Eng., Beijing Univ. of Technol., Beijing, China
  • fYear
    2011
  • fDate
    8-11 Aug. 2011
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    In this study, based on the conductive polymer filled with Ag-coated Cu dendritic powder (ACDP), Ag-coated glass fiber powder (AGFP) was selected as assistant filler to improve the conductive network. The results showed that the volume resistivity reached 0.004Ω·cm when the total fillers were less than 70.6 wt%. The effect of the filler content of the AGFP powder on the conductivity, creep behavior of resistance and piezo-resistivity properties of the conductive polymer was studied. Under constant pressure, the resistance creep behavior of the conductive polymer showed that the volume resistivity decreased nonlinearly with time. When the pressure was applied within 0-2.0MPa, the conductivity variation of the conductive polymer exhibited a positive pressure coefficient of resistance (PPCR). However, the piezoresistance effect could be neglected with increasing filler content and applied pressure. In addition, the reliability of the conductive polymer under aging at 85°C and 85% relative humidity (RH) in a temperature/humidity chamber was discussed.
  • Keywords
    ageing; conducting polymers; copper; creep; dendrites; electromagnetic interference; electromagnetic shielding; filled polymers; glass fibre reinforced plastics; glass fibres; piezoelectricity; piezoresistance; silver; ACDP; AGFP powder; Ag-Cu-SiO2; EMI shielding; PPCR; assistant filler; conductive polymer reliability; glass fiber; piezoresistance effect; piezoresistivity property; positive pressure coefficient of resistance; pressure 0 MPa to 2.0 MPa; temperature 85 degC; temperature-humidity chamber; volume resistivity; Aging; Conductivity; Copper; Creep; Packaging; Polymers; Resistance; conductive polymer; creep; glass fiber; piezoresistance effect; reliability; volume resistivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4577-1770-3
  • Electronic_ISBN
    978-1-4577-1768-0
  • Type

    conf

  • DOI
    10.1109/ICEPT.2011.6066827
  • Filename
    6066827