DocumentCode :
2183244
Title :
Preparation and properties of conductive polymer doped with Ag-coated glass fiber for EMI shielding
Author :
Liu, Xiaohei ; Xia, Zhidong ; Yuan, Bo ; Zhao, Mengke ; Guo, Fu
Author_Institution :
Mater. Sci. & Eng., Beijing Univ. of Technol., Beijing, China
fYear :
2011
fDate :
8-11 Aug. 2011
Firstpage :
1
Lastpage :
5
Abstract :
In this study, based on the conductive polymer filled with Ag-coated Cu dendritic powder (ACDP), Ag-coated glass fiber powder (AGFP) was selected as assistant filler to improve the conductive network. The results showed that the volume resistivity reached 0.004Ω·cm when the total fillers were less than 70.6 wt%. The effect of the filler content of the AGFP powder on the conductivity, creep behavior of resistance and piezo-resistivity properties of the conductive polymer was studied. Under constant pressure, the resistance creep behavior of the conductive polymer showed that the volume resistivity decreased nonlinearly with time. When the pressure was applied within 0-2.0MPa, the conductivity variation of the conductive polymer exhibited a positive pressure coefficient of resistance (PPCR). However, the piezoresistance effect could be neglected with increasing filler content and applied pressure. In addition, the reliability of the conductive polymer under aging at 85°C and 85% relative humidity (RH) in a temperature/humidity chamber was discussed.
Keywords :
ageing; conducting polymers; copper; creep; dendrites; electromagnetic interference; electromagnetic shielding; filled polymers; glass fibre reinforced plastics; glass fibres; piezoelectricity; piezoresistance; silver; ACDP; AGFP powder; Ag-Cu-SiO2; EMI shielding; PPCR; assistant filler; conductive polymer reliability; glass fiber; piezoresistance effect; piezoresistivity property; positive pressure coefficient of resistance; pressure 0 MPa to 2.0 MPa; temperature 85 degC; temperature-humidity chamber; volume resistivity; Aging; Conductivity; Copper; Creep; Packaging; Polymers; Resistance; conductive polymer; creep; glass fiber; piezoresistance effect; reliability; volume resistivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
Type :
conf
DOI :
10.1109/ICEPT.2011.6066827
Filename :
6066827
Link To Document :
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