Title :
Preparation and deposition process of Cu/Al powder in conductive polymer for EMI shielding
Author :
Zhang, Xing ; Xia, Zhidong ; Gao, Yong ; Zhao, Shaofan
Author_Institution :
Beijing Univ. of Technol., Beijing, China
Abstract :
Copper-aluminum powders were prepared by displacement method in aqueous system at 40°C. Composite powder´s surface topography was investigated by varying the addition of sodium fluoride (NaF). It was noted that dense and uniform copper coating was obtained when the mass ratio of NaF and aluminum powder was approximate 0.1. The mechanism of copper coating formation was discussed in detail. The deposition process was summarized to four stages, including initial reaction stage, grid formation stage, two-dimensional coating spread stage and final epitaxial growth stage.
Keywords :
aluminium; coatings; composite materials; conducting polymers; copper; electromagnetic interference; electromagnetic shielding; epitaxial growth; powders; surface topography; Cu-Al; EMI shielding; aqueous system; composite powder surface topography; conductive polymer; deposition process; displacement method; final epitaxial growth stage; grid formation stage; initial reaction stage; mass ratio; preparation process; temperature 40 degC; two-dimensional coating spread stage; Aluminum; Copper; Powders; Surface morphology; Surface topography; Surface treatment;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066828
