• DocumentCode
    2183764
  • Title

    Recent progress in the studies of low melting Sn-based Pb-free solders

  • Author

    Lin, Yang ; Yin, Luqiao ; Wei, Xicheng

  • Author_Institution
    Key Lab. of Adv. Display & Syst. Applic., Shanghai Univ., Shanghai, China
  • fYear
    2011
  • fDate
    8-11 Aug. 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Limited by the toxicity of Pb and Pb-containing compounds and the implementation of the mandatory legislations, such as WEEE and RoHS, the Pb-containing solders have been banned and accordingly the Pb-free solders have become popular in electronic industry. However, the novel developed Pb-free solders could cause a series of packaging defects such as delamination, cracking, and charring etc. due to the relatively high melting temperatures of these Pb-free substitutes compared to the former Sn-Pb.
  • Keywords
    RoHS compliance; electronics packaging; soldering; tin alloys; low melting lead free solder; mandatory legislation; packaging defect; Compounds; Gallium; Lead; Nanoparticles; Packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4577-1770-3
  • Electronic_ISBN
    978-1-4577-1768-0
  • Type

    conf

  • DOI
    10.1109/ICEPT.2011.6066847
  • Filename
    6066847