Title :
Effects of soldering temperature and cooling rate on the as-soldered microstructures of intermetallic compounds in Sn-Ag/Cu joint
Author :
Gu, Liyu ; Qu, Lin ; Ma, Haitao ; Luo, Zhongbing ; Wang, Lai
Author_Institution :
Sch. of Mater. Sci. & Eng., Dalian Univ. of Technol., Dalian, China
Abstract :
The as-soldered microstructures of intermetallic compounds (IMC) in Sn-Ag/Cu joint were investigated under different soldering temperatures and cooling rates. Scalloped, faceted, prismatic and hexagonal shape Cu6Sn5 grains were observed at the solder/Cu interface, respectively. Scalloped shape grains were found at 250°C. At higher soldering temperatures such as 275 °C and 300°C, faceted grains were dominant and the other two were mainly discovered under smaller cooling rates. Simultaneously, large plate-like Ag3Sn formed in virtue of interfacial Cu6Sn5 under furnace cooling, which was discussed based on the solidification sequence.
Keywords :
cooling; copper; crystal microstructure; silver alloys; soldering; solders; tin alloys; SnAg-Cu; as-soldered microstructures; cooling rate; faceted shape grains; hexagonal shape grains; intermetallic compounds; prismatic shape grains; scalloped shape grains; soldering temperature; temperature 250 degC; temperature 275 degC; temperature 300 degC; Compounds; Cooling; Copper; Intermetallic; Joints; Morphology; Soldering;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066848
