Title :
Preparation, liquid crystal property and thermodynamic property of Amine-terminated polyesterimide, as modifiers for epoxy resin
Author :
Gui, Dayong ; Hao, Jingfeng ; Si, Deqin ; Miao, Xin ; Zeng, Wentao ; Liu, Jianhong
Author_Institution :
Sch. of Chem. & Chem. Eng., Shenzhen Univ., Shenzhen, China
Abstract :
Epoxy resin is widely used in electronic packaging. However, neat epoxy resin is no suitable for high-performance applications because of its poor thermal stability and toughness. Polyimide is a kind of materials with high performance for their excellent thermal stability, dimensional stability and electric property, but it is generally insoluble and infusible, and this makes it difficult to process. In this study, Amine-terminated polyesterimide (ATPEI) polymers was synthesized and used as modifier of epoxy resin. The chemical structure of ATPEI was characterized by FT-IR spectrum. The two melting peaks of differential scanning calorimetry (DSC) show ATPEI manifested liquid crystal properties, which could be verified by Polarizing microscope (POM) and X-ray diffraction (XRD) respectively. ATPEI was used to improve the thermostability, mechanical properties and especially the toughness of bisphenol A diglycidyl ether epoxy resin(ER) cured with 4,4´-Methylenedianiline (DDM). The results show that the decomposition temperature of modified materials improve about 30°C compared with that of unmodified epoxy resin. The mechanical and dynamic mechanical properties were measured by universal testing machine and DMA. The results exhibit that ATPEI modified epoxy resin has good toughness.
Keywords :
Fourier transform spectroscopy; X-ray diffraction; differential scanning calorimetry; electronics packaging; liquid crystal polymers; resins; thermodynamic properties; 4,4´-Methylenedianiline; ATPEI; DDM; FTIR spectrum; X-ray diffraction; amine terminated polyesterimide; bisphenol A diglycidyl ether epoxy resin; chemical structure; differential scanning calorimetry; electronic packaging; liquid crystal properties; liquid crystal property; polarizing microscope; thermodynamic property; Epoxy resins; Erbium; Packaging; Temperature; Temperature measurement; Thermal stability; Epoxy resin; Polyesterimides; Synthesis; Thermomechanical properties;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066850