Title :
Analysis of Cu6Sn5 grain orientations in Sn3.0Ag0.5Cu lead-free solder joints
Author :
Tian, Yanhong ; Niu, Lina ; Wang, Chunqing
Author_Institution :
Sch. of Mater. Sci. & Eng., Harbin Inst. of Technol., Harbin, China
Abstract :
Electron backscatter diffraction (EBSD) technology combined with Orientation Imaging Microscopy (OIM) analysis method were employed to investigate the morphologies and orientations of Cu6Sn5 grains formed between Sn3.0Ag5.0Cu and polycrystalline copper, (001) (111) Cu single crystals under liquid-state condition. The reflow temperature was the main factor that influence the transformation of Cu6Sn5 grains from scallop-type to prism-type. The morphology for. the prism-type Cu6Sn5 grains formed on Cu single crystals arranged regularly, and their orientations had a strong dependence on the Cu substrates, the reason for which is the low misfit leading to the decreasing of surface energy.
Keywords :
copper alloys; crystal morphology; electron backscattering; electron diffraction; silver alloys; solders; surface energy; tin alloys; (001) (111) Cu single crystals; SnAgCu; electron backscatter diffraction; grain orientations; lead-free solder joints; liquid-state condition; morphology; orientation imaging microscopy; polycrystalline copper; reflow temperature; surface energy; Copper; Crystals; Electronics packaging; Morphology; Packaging; Soldering; Substrates;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066851
