• DocumentCode
    2184048
  • Title

    Magnetic-dielectric property of FeAlSi-CCTO-Epoxy composite for antennas miniaturization and embedded inductor-capacitor application

  • Author

    Yang, Wenhu ; Yu, Shuhui ; Sun, Rong ; Du, Ruxu

  • Author_Institution
    Shenzhen Inst. of Adv. Technol., Shenzhen, China
  • fYear
    2011
  • fDate
    8-11 Aug. 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper reports a FeAISi (sendust)/CaCu3Ti4O12 (CCTO)/Epoxy three-phase composite prepared through a simple procedure. The magnetic-dielectric properties of the composites were analyzed using impedance analyzer (Agilent 4991) in a frequency range from 106 to 109 Hz. The results show the weak coupling effect between the FeAISi and CCTO fillers in the three-phase composite. The real permeability (μ´) of the composite slightly increases from 1.4 to 1.6 with the CCTO content increasing from 3vol% to 18vol% at 108 Hz. The magnetic loss tangent remains at a relatively low level. The real dielectric constant (εr´) of the composite rises from 14 to 24.5 with the low loss tangent about 0.05 when the volume fraction of CCTO (fCCTO) increases from 3vol% to 18vol% at 108 Hz and room temperature. The applications in antenna miniaturization and embedded capacitors and inductors were discussed in view of several aspects.
  • Keywords
    aluminium compounds; antennas; calcium compounds; capacitors; composite materials; copper compounds; inductors; iron compounds; permeability; permittivity; titanium compounds; FeAlSi-CaCu3Ti4O12; antenna miniaturization; dielectric constant; embedded inductor-capacitor; epoxy three-phase composite; frequency 10000000 Hz to 10000000000 Hz; impedance analyzer; magnetic loss tangent; magnetic-dielectric property; real permeability; temperature 293 K to 298 K; weak coupling effect; Antennas; Capacitors; Inductors; Loading; Permeability; Permittivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4577-1770-3
  • Electronic_ISBN
    978-1-4577-1768-0
  • Type

    conf

  • DOI
    10.1109/ICEPT.2011.6066857
  • Filename
    6066857