Title :
Viscosity and thermal conductivity of alumina microball/epoxy composites
Author :
Yu, Hui ; Li, Liangliang ; Qi, Longhao
Author_Institution :
Dept. of Mater. Sci. & Eng., Tsinghua Univ., Beijing, China
Abstract :
Filling ceramic particles that exhibit high thermal conductivity into a polymer is an effective way to enhance the thermal conductivity of the polymer. Alumina (Al2O3) microballs were chosen as the fillers to confirm whether their super-spherical structure would enlarge the maximum filling content of the filler into the polymer matrix. The impacts of Al2O3 microballs on the thermal conductivity of the composites and the viscosity of pre-curing suspension were investigated. The viscosity increased slightly when a 20 vol. % of Al2O3 microballs were filled, and when the filling content reached 50 vol. %, the viscosity was still relatively lower than that of the epoxy with roughly spherical AlN granules. A high thermal conductivity of 2.70 W/(m·K) was achieved with an Al2O3 microball content of 60 vol. %.
Keywords :
alumina; ceramics; composite materials; polymers; thermal conductivity; viscosity; Al2O3; alumina microball; ceramic particles; epoxy composites; polymer matrix; pre-curing suspension; superspherical structure; thermal conductivity; viscosity; Ceramics; Conductivity; Electronic packaging thermal management; Filling; Polymers; Thermal conductivity; Viscosity; alumina microballs; composite; thermalconductivity; viscosity;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066859