Title :
Evaluation of techniques for bonding wires to quantized Hall resistors
Author_Institution :
Dept. of Commerce, Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
fDate :
June 27 1994-July 1 1994
Abstract :
Three different techniques for mounting quantized Hall resistors with AuGe/Ni alloyed contacts were evaluated. The best quality and most robust samples were made by evaporating bonding pads that overlapped the alloyed contacts and the substrate, so that bonds could be made over the substrate rather than over the heterostructure.<>
Keywords :
electrical contacts; lead bonding; metallisation; quantum Hall effect; resistors; AuGe-Ni; AuGe/Ni alloyed contacts; bonding pad evaporation; heterostructure; quantized Hall resistors; substrate; wire bonding; Bonding; Contact resistance; Gallium arsenide; Gold; NIST; Nickel alloys; Resistors; Soldering; Temperature; Wires;
Conference_Titel :
Precision Electromagnetic Measurements, 1994. Digest., 1994 Conference on
Conference_Location :
Boulder, CO, USA
Print_ISBN :
0-7803-1984-2
DOI :
10.1109/CPEM.1994.333279
