The effect of functionalized silver on properties of conductive adhesives

Author

Fan, Qiong ; Cui, Huiwang ; Li, Dongsheng ; Hu, Zhili ; Yuan, Zhichao ; Ye, Lilei ; Liu, Johan

Author_Institution

Key Lab. of Adv. Display & Syst. Applic., Shanghai Univ., Shanghai, China

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

3

Abstract

This research used low molecular surface modifiers and observed that chemisorptions took place through the formation of a bond between silver surface and an adsorbed molecule, which improved the dispersion of silver flakes in the organic resin. Results of shear viscosity, bulk resistivity etc. showed that by using these low molecular organic functionalizers, isotropic conductive adhesives (ICAs) with lower shear viscosity and better electrical conductivity at high silver fillers content were obtained. Different processing methods and different matrixes were compared.

Keywords

adhesives; adsorption; chemisorption; composite materials; electrical conductivity; electrical resistivity; resins; silver; viscosity; Ag; adsorbed molecule; bulk resistivity; chemisorptions; conductive adhesives; electrical conductivity; functionalized silver; isotropic conductive adhesives; low molecular organic functionalizers; low molecular surface modifiers; organic resin; shear viscosity; silver flakes; silver surface; Conductive adhesives; Conductivity; Curing; Dispersion; Resins; Silver; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066868

Filename

6066868