Title :
A novel wirebond-BGA CPU package
Author :
Qidong, Wang ; Liqiang, Cao ; Jun, Li ; Jin, Zhang ; Daniel, Guidotti ; Lixi, Wan
Author_Institution :
Inst. of Microelectron., Beijing, China
Abstract :
The evolution of microprocessor packaging continues to be driven by ever increasing performance, economics and different market segment requirements. CPU evolution in performance/cost is driving the packaging technology continuously. Institute of Microelectronics, Chinese Academy of Sciences has implemented the CPU packaging in 2010. The fabricated package meets all the requirements by Loongson Company, and becomes the first fully domestically packaged CPU in China.
Keywords :
ball grid arrays; lead bonding; CPU evolution; ball grid arrays; market segment requirements; microprocessor packaging; wirebond-BGA CPU package; Assembly; Bonding; Fingers; Packaging; Routing; Substrates; Wires; CPU package; Cavity-down; Heat dissipation; Wirebond BGA;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066875
