Title :
Study of Joule heating effects in lead-free solder joints under Electromigration
Author :
Xu, Guangchen ; Guo, Fu ; Lee, Andre ; Subramanian, K.N. ; Wright, Neil
Abstract :
Basic understanding of heating conduction in lead-free solder joints due to the Joule heating effect was carried out by using the infrared (IR) microscopy. In order to interpret the corresponding mechanism and provide a better understanding to Electromigration (EM) studies, a newly developed ID solder joint with same cross-sectional area in solder alloy and Cu electrodes was employed in our thermal imaging analysis. Both eutectic SnBi and SnAgCu solder alloy were used to fabricate the joints due to their distinct electrical resistivity and thermal conductivity. Various electrical current inputs combined with joints´ thickness of 500 μm were investigated. Accordingly, transient and steady-state heat conduction were identified and compared with different experimental conditions.
Keywords :
ball grid arrays; bismuth alloys; copper alloys; electrical resistivity; electrodes; electromigration; flip-chip devices; heat conduction; infrared imaging; silver alloys; solders; thermal conductivity; tin alloys; ID solder joint; Joule heating effects; SnAgCu; SnBi; ball grid array; electrical resistivity; electromigration; flip chip; infrared microscopy; lead-free solder joints; size 500 mum; solder alloy; steady-state heat conduction; thermal conductivity; thermal imaging analysis; transient heat conduction; Copper; Current density; Heating; Soldering; Switches; Temperature distribution; Temperature measurement;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066877
