• DocumentCode
    2184668
  • Title

    Economic efficiency analysis of wafer fabrication facilities

  • Author

    Chen, Wen-Chih ; Chien, Chen-Fu ; Chou, Ming-Hsuan

  • Author_Institution
    Dept. of Ind. Eng. & Manage., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2008
  • fDate
    7-10 Dec. 2008
  • Firstpage
    2216
  • Lastpage
    2222
  • Abstract
    Semiconductor industry is capital intensive and competitive, and thus efficiently utilizing resources to provide products and services is essential for maintaining competitive advantages. Knowing whether the resource is properly utilized is the foundation for future improvements and/or decision making. This study investigates the economic efficiency of fabrication facility (fab) operations. We develop a two-stage overall efficiency model, which clearly defines and explains the ¿real¿ performance of fab production operations and the non-production issues. The model provides an overall performance index while considering different aspects. A single performance index can be used to evaluate and rank the performance for period review. Factors affecting performance can be identified. Furthermore, according to a real case, an ex post relative efficiency analysis is conducted and the initial results are reported. The case study can help providing diagnosis for inefficient production facilities and identifying best practices of efficient production units.
  • Keywords
    decision making; industrial economics; integrated circuit manufacture; performance index; decision making; economic efficiency analysis; performance index; semiconductor industry; wafer fabrication facilities; Data envelopment analysis; Decision making; Electronics industry; Fabrication; Industrial engineering; Manufacturing; Performance analysis; Production; Productivity; Semiconductor device manufacture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation Conference, 2008. WSC 2008. Winter
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-2707-9
  • Electronic_ISBN
    978-1-4244-2708-6
  • Type

    conf

  • DOI
    10.1109/WSC.2008.4736322
  • Filename
    4736322