• DocumentCode
    2184762
  • Title

    Investigation of bulk resistance for metal-coated polymer particles used in anisotropic conductive adhesive

  • Author

    Chen, Xiancai ; Tao, Bo ; Yin, Zhouping

  • Author_Institution
    State Key Lab. of Digital Manuf. Equip. & Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China
  • fYear
    2011
  • fDate
    8-11 Aug. 2011
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    This work presents a novel method to evaluate the bulk resistance of the Au/Ni coated polymer particles of anisotropic conductive adhesive (ACA) joints, considering the bending of electric streamlines and the nonuniformity of current density in the metal layers of particles. The bulk resistance calculated by this new method and conventional methods are compared and the results show that the values gotten by the conventional methods which assume that the current across the particles distributes uniformly are seriously underestimated. Based on the new method, the effects of bonding force and ACA´s geometric parameters on the bulk resistance are investigated respectively. It is found that the bonding force and Au layer thickness are the most important factors to influence the bulk resistance. Ni layer thickness is also very important to the bulk resistance but less sensitive than the Au layer thickness. It is also found that the polymer core diameter has little effect on the bulk resistance when it is more than 3 μm. Finally, the suitable ranges of all these parameters are recommended to ensure the low stable bulk resistance.
  • Keywords
    bonding processes; conductive adhesives; current density; electrical resistivity; gold; nickel; polymers; ACA geometric parameters; ACA joints; Au layer thickness; Au-Ni; Ni layer thickness; anisotropic conductive adhesive; bonding force; bulk resistance; current density; electric streamline bending; metal-coated polymer particles; particle metal layers; polymer core diameter; Electric potential; Gold; Joints; Nickel; Polymers; Resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4577-1770-3
  • Electronic_ISBN
    978-1-4577-1768-0
  • Type

    conf

  • DOI
    10.1109/ICEPT.2011.6066882
  • Filename
    6066882