Title :
Morphology and nanoindentation properties of intermetallic compounds in solder joints
Author :
Weixu, Zhong ; Fei, Qin ; Tong, An ; Chengyan, Liu
Author_Institution :
Coll. of Mech. Eng. & Appl. Electron. Technol., Beijing Univ. of Technol., Beijing, China
Abstract :
The growth of intermetallic compounds (IMC) at the Sn3.0Ag0.5Cu/Cu interface is investigated under aging temperature of 150°C and aging time of 100, 300 and 500 hours. The relationship between the thickness of the IMC and aging time is fitted out, and the growth law of the IMC at Sn3.0Ag0.5Cu/Cu interface under isothermal aging condition is obtained. Mechanical properties of the Cu6Sn5 and Cu3Sn are obtained by a G200 nanoindentation tester. It indicates that with the Cu6Sn5 thickness increases, its Young´s modulus and hardness have no change. The Young´s modulus of Cu3Sn is greater than that of Cu6Sn5, but the hardness of Cu3Sn is lower than that of Cu6Sn5. The nanoindentation experiments of the Sn3.0Ag0.5Cu/Cu interfacial zone show that the hardness of Cu, Cu3Sn, Cu6Sn5 and Sn3.0Ag0.5Cu has an order in magnitude of Cu6Sn5 >; Cu3Sn >; Cu >; Sn3.0Ag0.5Cu.
Keywords :
Young´s modulus; ageing; copper alloys; hardness; nanoindentation; silver alloys; solders; tin alloys; SnAgCu-Cu; Young modulus; aging temperature; aging time; hardness; interfacial zone; intermetallic compounds; isothermal aging condition; nanoindentation tester; solder joints; temperature 150 degC; time 100 hour; time 300 hour; time 500 hour; Aging; Copper; Electronics packaging; Isothermal processes; Morphology; Soldering; Young´s modulus;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066890
