Ultra-wideband noise isolation on power distribution network of high-speed package substrate

This paper presents an effective power noise isolation and suppression method in high-speed package substrates, which is based on planar electromagnetic bandgap (EBG) in local area of power/ground plane and embedded capacitor material between the power and ground planes. Compared with the performance of continuous power and ground planes, the proposed structure provides greater than -40dB isolation in S-parameter simulation at frequency above 1GHz, and shows excellent isolation (-70 ~ -140 dB) from 2GHz up to over 30 GHz frequency range. The structure can be used to minimize the risk of power noise interference between different dies from a shared power supply system in board or out of board.