Title :
Ultra-wideband noise isolation on power distribution network of high-speed package substrate
Author :
Li, Baoxia ; Wan, Lixi
Author_Institution :
Inst. of Microelectron., Beijing, China
Abstract :
This paper presents an effective power noise isolation and suppression method in high-speed package substrates, which is based on planar electromagnetic bandgap (EBG) in local area of power/ground plane and embedded capacitor material between the power and ground planes. Compared with the performance of continuous power and ground planes, the proposed structure provides greater than -40dB isolation in S-parameter simulation at frequency above 1GHz, and shows excellent isolation (-70 ~ -140 dB) from 2GHz up to over 30 GHz frequency range. The structure can be used to minimize the risk of power noise interference between different dies from a shared power supply system in board or out of board.
Keywords :
S-parameters; capacitors; electronics packaging; high-k dielectric thin films; interference suppression; photonic band gap; ultra wideband technology; S-parameter simulation; effective power noise isolation; embedded capacitor material; frequency 2 GHz to 30 GHz; high-speed package substrate; noise suppression method; planar electromagnetic bandgap; power distribution network; power noise interference; power supply system; power-ground plane; ultrathin high-k EMC dielectric; ultrawideband noise isolation; Bridge circuits; Capacitors; Metamaterials; Noise; Passive optical networks; Periodic structures; Spirals;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066893
