DocumentCode
2185128
Title
Experimental investigation of gas flow in copper channel carbon nanotubes coated micro coolers
Author
Dianxiao, Wang ; Jiameng, He ; Xiaojing, Wang ; Jia, Wang ; Zongshuo, Li ; Yifeng, Fu ; Johan, Liu
Author_Institution
Sch. of Mechatron. Eng. & Autom., Shanghai Univ., Shanghai, China
fYear
2011
fDate
8-11 Aug. 2011
Firstpage
1
Lastpage
4
Abstract
As the integrity of micro electronic devices improves, the heat power of chips is getting higher and higher. How to reduce the temperature of micro electronic devices effectively becomes more and more important. In this paper, a micro-channel cooler test system is set up. By measuring the temperature and pressure at inlet and outlet of the micro cooler and the average temperature of micro cooler bottom, the heat transfer performance of the copper based CNTs coated micro cooler is researched. The thermal resistance of copper and silicon based CNTs coated micro cooler are compared. It is shown that the copper based CNTs coated micro cooler has good thermal dissipation capacity than that of the Silicon based CNTs coated micro cooler.
Keywords
carbon nanotubes; micromechanical devices; thermal resistance; copper channel carbon nanotubes; gas flow; heat transfer performance; microcoolers; microelectronic devices; thermal resistance; Copper; Heat transfer; Resistance heating; Silicon; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4577-1770-3
Electronic_ISBN
978-1-4577-1768-0
Type
conf
DOI
10.1109/ICEPT.2011.6066898
Filename
6066898
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