• DocumentCode
    2185128
  • Title

    Experimental investigation of gas flow in copper channel carbon nanotubes coated micro coolers

  • Author

    Dianxiao, Wang ; Jiameng, He ; Xiaojing, Wang ; Jia, Wang ; Zongshuo, Li ; Yifeng, Fu ; Johan, Liu

  • Author_Institution
    Sch. of Mechatron. Eng. & Autom., Shanghai Univ., Shanghai, China
  • fYear
    2011
  • fDate
    8-11 Aug. 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    As the integrity of micro electronic devices improves, the heat power of chips is getting higher and higher. How to reduce the temperature of micro electronic devices effectively becomes more and more important. In this paper, a micro-channel cooler test system is set up. By measuring the temperature and pressure at inlet and outlet of the micro cooler and the average temperature of micro cooler bottom, the heat transfer performance of the copper based CNTs coated micro cooler is researched. The thermal resistance of copper and silicon based CNTs coated micro cooler are compared. It is shown that the copper based CNTs coated micro cooler has good thermal dissipation capacity than that of the Silicon based CNTs coated micro cooler.
  • Keywords
    carbon nanotubes; micromechanical devices; thermal resistance; copper channel carbon nanotubes; gas flow; heat transfer performance; microcoolers; microelectronic devices; thermal resistance; Copper; Heat transfer; Resistance heating; Silicon; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4577-1770-3
  • Electronic_ISBN
    978-1-4577-1768-0
  • Type

    conf

  • DOI
    10.1109/ICEPT.2011.6066898
  • Filename
    6066898