DocumentCode :
2185128
Title :
Experimental investigation of gas flow in copper channel carbon nanotubes coated micro coolers
Author :
Dianxiao, Wang ; Jiameng, He ; Xiaojing, Wang ; Jia, Wang ; Zongshuo, Li ; Yifeng, Fu ; Johan, Liu
Author_Institution :
Sch. of Mechatron. Eng. & Autom., Shanghai Univ., Shanghai, China
fYear :
2011
fDate :
8-11 Aug. 2011
Firstpage :
1
Lastpage :
4
Abstract :
As the integrity of micro electronic devices improves, the heat power of chips is getting higher and higher. How to reduce the temperature of micro electronic devices effectively becomes more and more important. In this paper, a micro-channel cooler test system is set up. By measuring the temperature and pressure at inlet and outlet of the micro cooler and the average temperature of micro cooler bottom, the heat transfer performance of the copper based CNTs coated micro cooler is researched. The thermal resistance of copper and silicon based CNTs coated micro cooler are compared. It is shown that the copper based CNTs coated micro cooler has good thermal dissipation capacity than that of the Silicon based CNTs coated micro cooler.
Keywords :
carbon nanotubes; micromechanical devices; thermal resistance; copper channel carbon nanotubes; gas flow; heat transfer performance; microcoolers; microelectronic devices; thermal resistance; Copper; Heat transfer; Resistance heating; Silicon; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
Type :
conf
DOI :
10.1109/ICEPT.2011.6066898
Filename :
6066898
Link To Document :
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