Title :
Modeling and design of coplanar structure in QFP80 package for RFIC applications
Author :
Sun, Haiyan ; Wu, Jianhui ; Sun, Ling ; Jing, Weiping
Author_Institution :
Nat. ASIC Syst. Eng. Res. Center, Southeast Univ., Nanjing, China
Abstract :
A 6-Gb/s packaging solution that uses low cost quad flat pack (QFP) technology is presented. Due to the large inductance, such a high speed is beyond the reach of traditional QFP package designs. A coplanar transmission line structure used for leads optimization has been developed. Both traditional and optimized structures have been modeled and analyzed. The simulation results show that the optimized structure has extended the RFIC package bandwidth up to 6.1GHz (at -15dB).
Keywords :
coplanar transmission lines; integrated circuit design; integrated circuit modelling; integrated circuit packaging; radiofrequency integrated circuits; QFP80 package design; RFIC package; bit rate 6 Gbit/s; coplanar structure design; coplanar transmission line structure; leads optimization; low cost quad flat pack technology; Electronics packaging; Equivalent circuits; Integrated circuit modeling; Lead; Packaging; Radiofrequency integrated circuits; Wires;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066901
