DocumentCode
2185332
Title
Simulation for the contact resistance of a single anisotropic conductive adhesive particle with rough surface
Author
Chen, Xiancai ; Tao, Bo ; Yin, Zhouping
Author_Institution
State Key Lab. of Digital Manuf. Equip. & Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear
2011
fDate
8-11 Aug. 2011
Firstpage
1
Lastpage
5
Abstract
In anisotropic conductive adhesive (ACA) bonding, the components´ surfaces are not completely smooth and there are a great number of individual micro spots on the contact surfaces between particles and metal pads. However, most of the previous studies about contact resistance of ACA joints have neglected the roughness of contact surfaces between particles and metal pads and thus it may underestimate the contact resistance. This paper presents a model to analyze the effects of the roughness on the contact resistance of an ACA joint with Au coated polymer particles. The rough surface is constructed with micro cylinders and the roughness is represented with asperity density, asperity height and asperity radius. The model finds that the contact resistance increases obviously with the decrement of asperity density and asperity radius, while it is not sensitive to asperity height. In addition, the bulk resistance of asperities should be considered if the asperity radius is too small, and it even may play a major role on the contact resistance. In conclusion, the roughness of contact surfaces should be considered to calculate contact resistance accurately, otherwise, the contact resistance may be underestimated.
Keywords
adhesives; contact resistance; surface roughness; ACA joints; asperity density; asperity radius; bulk resistance; coated polymer particles; contact resistance; microcylinders; single anisotropic conductive adhesive particle; surface roughness; Contact resistance; Joints; Rough surfaces; Surface resistance; Surface roughness; Surface treatment;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4577-1770-3
Electronic_ISBN
978-1-4577-1768-0
Type
conf
DOI
10.1109/ICEPT.2011.6066905
Filename
6066905
Link To Document