• DocumentCode
    2185332
  • Title

    Simulation for the contact resistance of a single anisotropic conductive adhesive particle with rough surface

  • Author

    Chen, Xiancai ; Tao, Bo ; Yin, Zhouping

  • Author_Institution
    State Key Lab. of Digital Manuf. Equip. & Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China
  • fYear
    2011
  • fDate
    8-11 Aug. 2011
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    In anisotropic conductive adhesive (ACA) bonding, the components´ surfaces are not completely smooth and there are a great number of individual micro spots on the contact surfaces between particles and metal pads. However, most of the previous studies about contact resistance of ACA joints have neglected the roughness of contact surfaces between particles and metal pads and thus it may underestimate the contact resistance. This paper presents a model to analyze the effects of the roughness on the contact resistance of an ACA joint with Au coated polymer particles. The rough surface is constructed with micro cylinders and the roughness is represented with asperity density, asperity height and asperity radius. The model finds that the contact resistance increases obviously with the decrement of asperity density and asperity radius, while it is not sensitive to asperity height. In addition, the bulk resistance of asperities should be considered if the asperity radius is too small, and it even may play a major role on the contact resistance. In conclusion, the roughness of contact surfaces should be considered to calculate contact resistance accurately, otherwise, the contact resistance may be underestimated.
  • Keywords
    adhesives; contact resistance; surface roughness; ACA joints; asperity density; asperity radius; bulk resistance; coated polymer particles; contact resistance; microcylinders; single anisotropic conductive adhesive particle; surface roughness; Contact resistance; Joints; Rough surfaces; Surface resistance; Surface roughness; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4577-1770-3
  • Electronic_ISBN
    978-1-4577-1768-0
  • Type

    conf

  • DOI
    10.1109/ICEPT.2011.6066905
  • Filename
    6066905