Solder prefrom application

Author

Yu, Hu ; Ming, Shen ; Gong, Angela ; Lu, Alan

Author_Institution

Electron. Assembly Processes & Mater., Siemens Ltd., China

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

5

Abstract

Solder preforms are generally made from solder alloy wire or stamped from solder alloy sheet material, produced in large quantities with tight tolerance. It´s almost no limitation in shapes, sizes and alloy-composition. In this work, different solder preforms in shape and volume were used to supplement additional solder volume in several different component packages. The fill rate, void and formation of intermetallic compounds (IMC) were investigated by optical microscope, X-ray and cross section. It was found that solder preform is good option to provide extra solder material with low cost and high quality on miniaturization and complication PCBa assembly.

Keywords

X-ray microscopy; electronics packaging; optical microscopes; printed circuits; solders; PCB assembly; X-ray microscope; component packages; intermetallic compounds; optical microscope; solder alloy sheet material; solder alloy wire; solder preform application; Connectors; Electronics packaging; Materials; Metals; Preforms; Shape; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066925

Filename

6066925