Title :
A new measurement method and electrical design for high density optoelectronics integration
Author :
Liu, Fengman ; Li, Baoxia ; Zhou, Yunyan ; Gao, Wei ; Xiang, Haifei ; Wang, Haidong ; Song, Jian ; Li, Zhihua ; Yang, Kun ; Li, Jun ; Cao, Liqiang ; Wan, Lixi
Author_Institution :
Inst. of Microelectron., Beijing, China
Abstract :
This paper describes a parallel test method based on a cross-point switch which can be programmed to control signal path and the number of switches to be opened according to the number of channels to be tested. In this method, at the transmitting side, one source inputted cross-point switch can be fan-out to multi sources to activate device under test, and different signal trace or length of cables can change phases between multi sources. At the receiving side, all output channels are connected to another RF switch controlled to choose output channel. These two switches both are controlled by software. Multi channels working together will help evaluating cross talk between channels and SSN noise test. In this paper, to ensure test accuracy, signal integrity of DUT and test system is designed and simulated. And an 8-channel optical transceiver is tested using this method and cross talk and power noise are especially showed and analyzed. The test results indicate this test method can meet parallel optical transmission test requirement and other optical module and electrical module test; however the cost is greatly lower than high speed test instruments.
Keywords :
electronics packaging; integrated optoelectronics; optical transceivers; 8-channel optical transceiver; RF switch; SSN noise test; cross-point switch; device under test; electrical design; high density optoelectronics integration; parallel optical transmission test requirement; parallel test method; power noise; signal integrity; signal path; Adaptive optics; High speed optical techniques; Integrated optics; Noise; Optical switches; Substrates;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066929