Void mechanism research and control in solder joint

Author

Xiaoqiang, Xie ; Jianwei, Zhou ; Jonghyun, Chae ; Myungkee, Chung

Author_Institution

Samsung Semicond. China R&D, Suzhou, China

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

4

Abstract

Void formation mechanism was studied and so were the key factors for SMT voids. 2 kinds of solders (SAC305 & SnPb) and 2 kinds of pad finishes (ENIG and OSP) were compared. Key factors of reflow profile were also evaluated. Reflow atmosphere were evaluated to observe the effects on void. Stencil thickness on void formation was also studied. Results show that by adjusting all these factors, the maximum void size and void quantity can be controlled. It is also found that using higher melting point solder ball and lower melt point solder paste together will get void-free SMT result which also impresses the understanding of void forming mechanism: Gas of reaction and volatilization is trapped by melted solder particles in solder paste and form voids.

Keywords

reflow soldering; solders; surface mount technology; ENIG; OSP; SAC305; melt point solder paste; melting point solder ball; pad finishes; reflow atmosphere; reflow profile; solder joint; stencil thickness; void formation; void mechanism research; void quantity; void size; void-free SMT; Atmosphere; Electronics packaging; Mass production; Packaging; Solids; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066934

Filename

6066934