Title :
Development of a three-dimensional integrated solder ball bumping & bonding method for MEMS devices
Author :
Yang, Lei ; Liu, Wei ; Wang, Chunqing ; Tian, Yanhong
Author_Institution :
State Key Lab. of Adv. Welding & Joining, Harbin Inst. of Technol., Harbin, China
Abstract :
Compared with integrated circuits, MEMS devices are more sophisticated and diverse. The complex non-planar micro components of MEMS devices raise the urgent needs for three-dimensional (3-D) packaging. To fulfill the specific needs in 3-D MEMS packaging, the basic concepts of a new 3-D integrated solder ball bumping & bonding method for MEMS devices was proposed. A prototype platform was developed according to the concepts with pads detection, micro solder ball manipulation, fluxless laser reflowing and bumps repairing processes. In the prototype platform, an improved center detection algorithm with the combination of the randomized Hough transform and the least squares method was integrated. The detecting tests indicated that the precision of the detecting algorithm can reach 0.21μm, and its computing time was less than 10ms. With further experiments verification, solder bumping and microsensors packaging experiments were carried out.
Keywords :
Hough transforms; electronics packaging; microsensors; solders; MEMS devices; fluxless laser; microsensors packaging experiments; microsolder ball manipulation; pad detection; randomized Hough transform; three-dimensional integrated solder ball bonding method; three-dimensional integrated solder ball bumping method; Bonding; Heating; Image edge detection; Lasers; Micromechanical devices; Packaging; Prototypes;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066935
