The stress-strain behaviors of solder joints during thermal fatigue process

Author

Zhiting, Geng ; He Qing ; Guohai, Cheng ; Jusheng, Ma

Author_Institution

Sch. of Energy & Power Eng., North China Electr. Power Univ., Beijing, China

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

4

Abstract

By means of establishing experimental model, the mechanical behavior and changes in basic parameters of new Sn-Zn system lead-free solder joint in thermal fatigue process were studied, and using the result to evaluate the performance of this new type of lead-free solder, providing the accurate boundary conditions for the reliability estimation methods (finite element analysis) of solder. This study of solder joint reliability and life assessment in thermal fatigue process has very important theoretical and practical significance.

Keywords

electronics packaging; finite element analysis; reliability; soldering; solders; stress-strain relations; thermal stress cracking; Sn-Zn; boundary condition; finite element analysis; lead-free solder joint; life assessment; mechanical behavior; reliability estimation method; solder joint reliability; stress-strain behavior; thermal fatigue process; Copper; Fatigue; Lead; Soldering; Strain; Thermal stresses; lead-free solder; stress-strain; thermal fatigue;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066944

Filename

6066944