DocumentCode
2186524
Title
3D Analysis of Complex Interconnects via Reduced-Order Modeling
Author
Benel, J. ; Pichon, Lionel
fYear
2007
fDate
17-21 Sept. 2007
Firstpage
860
Lastpage
863
Abstract
This paper presents a reduced-order modeling (ROM) applied on a 3D finite element model. It allows to obtain a time-domain reduced model which keeps the same behavior as the original one. To illustrate the methodology, the technique is applied to typical conducting tracks and cables.
Keywords
cables (electric); finite element analysis; interconnections; reduced order systems; time-domain analysis; 3D analysis; 3D finite element model; complex interconnects; conducting cables; conducting tracks; reduced-order modeling; time-domain reduced model; Electromagnetic compatibility; Equations; Finite element methods; Integrated circuit interconnections; Linear systems; Mathematical model; Read only memory; Time domain analysis; Transfer functions; Wideband;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetics in Advanced Applications, 2007. ICEAA 2007. International Conference on
Conference_Location
Torino
Print_ISBN
978-1-4244-0767-5
Electronic_ISBN
978-1-4244-0767-5
Type
conf
DOI
10.1109/ICEAA.2007.4387440
Filename
4387440
Link To Document