DocumentCode
2186539
Title
Die attach quality testing by fully contact-less measurement method
Author
Bognar, G. ; Horvath, G. ; Szues, Z. ; Szekely, V.
Author_Institution
Dept. of Electron Devices, Budapest Univ. of Technol. & Econ.
fYear
2006
fDate
18-21 April 2006
Firstpage
79
Lastpage
80
Abstract
The paper presents a novel, fully contact-less method for detecting die attach problems of semiconductor devices by measuring the dilatation resulting from thermal expansion. Laser interferometer measuring system was used to measure the thermal dilatation caused by infrared radiation directed onto the measured structure. By using the contact based stylus measurement method the previously got results have been cross-verified
Keywords
light interferometry; microassembling; production testing; quality control; semiconductor device manufacture; contact-less measurement method; die attach problem detection; infrared radiation; laser interferometer measuring system; package void detection; quality testing; semiconductor devices; thermal dilatation; thermal expansion; Displacement measurement; Laser beams; Microassembly; Micromechanical devices; Mirrors; Optical retarders; Packaging; Polarization; Semiconductor device measurement; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Diagnostics of Electronic Circuits and systems, 2006 IEEE
Conference_Location
Prague
Print_ISBN
1-4244-0185-2
Type
conf
DOI
10.1109/DDECS.2006.1649578
Filename
1649578
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