Title :
Irregular tin whisker growth on the surface of Sn-3.8Ag-0.7Cu-1.0RE solder joints
Author :
Hao, Hu ; Tian, Jun ; Xu, Guangchen ; Guo, Fu ; Song, Yonglun ; Shi, Yaowu
Author_Institution :
Coll. of Mater. Sci. & Eng., Beijing Univ. of Technol., Beijing, China
Abstract :
The morphology of tin whiskers on the surface of the oxidized RE-Sn phases was observed by SEM. The results show that, besides the regular pencil-shaped whiskers, chrysanthemum-type whisker; spiral whisker; plate-like whisker; whisker with a non-constant cross section; branch-type whisker and joint-type whisker were also found in this study. It is suggested that except for the special case, the stress state around the root of whisker and the supply of tin atoms together influence the morphology of tin whisker.
Keywords :
scanning electron microscopy; silver compounds; solders; tin compounds; whiskers (crystal); SEM; SnAgCu; branch-type whisker; chrysanthemum-type whisker; irregular tin whisker growth; joint-type whisker; oxidized RE-Sn phase; plate-like whisker; regular pencil-shaped whisker; solder joints; spiral whisker; Compressive stress; Copper; Force; Pediatrics; Surface morphology; Surface treatment; Tin;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066950
