Title :
Tensile Properties of PV Ribbons with Sn-Pb Coatings
Author :
Wu, Xuewei ; Ding, Dongyan ; Han, Bai ; Yu, Yunhong ; Wang, Yimin ; Li, Ming ; Mao, Dali
Author_Institution :
Sch. of Mater. Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China
Abstract :
Global escalating demand for energy is opening up the opportunities for utilization of solar energy, while photovoltaic (PV) cell is considered as one of the finest ways to harness the solar power. PV ribbon, which is a copper ribbon coated with tin-lead or lead-free solders, is one of the key PV cell components to connect cells. In this paper, tensile properties of PV ribbons coated with Sn-Pb were investigated through tensile testing and micro structural characterization with scanning electron microscope and optical metallography. The effect of tensile rate on the tensile strength, elongation and fracture mechanism was focused. It was found that the tensile strength increased with increase of the tensile rate. Whereas, the elongation decreased with increase of the tensile rate. Different grain deformation was found under different tensile rate.
Keywords :
copper; deformation; elongation; fracture mechanics; lead alloys; metallography; photovoltaic cells; scanning electron microscopy; surface morphology; tensile strength; tensile testing; tin alloys; Cu-SnPb; PV ribbons; coatings; elongation; fracture mechanism; grain deformation; microstructural characterization; optical metallography; photovoltaic cell; scanning electron microscope; solar energy; solar power; tensile properties; tensile rate; tensile strength; tensile testing; Coatings; Copper; Scanning electron microscopy; Surface cracks; Surface morphology; Surface treatment; Testing;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066953
