Title :
Application of response surface methods in Lead-free solder joints of plastic ball grid array thermal fatigue life prediction
Author :
Qiang, Zhao ; Zhou, Dejian
Author_Institution :
Sch. of Mech. & Electr. Eng., Guilin Univ. of Electron. Technol., Guilin, China
Abstract :
Aiming at solder ball diameter, solder ball height, solder ball distance and welding plate thickness these four factors of Lead-free solder ball in plastic micro ball grid array devices, this paper uses the analysis method of the combination of the finite element analogy and response method, to analysis thermal fatigue life of lead-free solder ball in plastic micro ball grid array device. Based on 29 experiment combinations under hot cyclic loading the mechanical simulation analysis, surface response method is used to get the stress-strain ring change range of maximum shear stress solder about Prediction model. The results show that, when the solder ball diameter of 0.7 mm, solder ball height of 0.4 mm, solder ball distance of 1.27 mm, welding plate thickness of 0.03 mm, the Numerical Δr is minimum, and the corresponding solder life is the largest. Meanwhile the influencing degree of 4 factors about statistics Δr, is Solder ball diameter>;solder ball distance >; solder ball height>; welding plate thickness. Namely solder ball diameter of lead-free solder ball has biggest influence of thermal fatigue life.
Keywords :
ball grid arrays; finite element analysis; plastic packaging; response surface methodology; solders; stress-strain relations; thermal stress cracking; distance 1.27 mm; finite element analogy; hot cyclic loading; lead-free solder ball; lead-free solder joint; maximum shear stress solder; mechanical simulation analysis; plastic microball grid array device; response surface method; size 0.03 mm; size 0.4 mm; size 0.7 mm; solder ball diameter; solder ball distance; solder ball height; stress-strain ring change; thermal fatigue life prediction model; welding plate thickness; Analytical models; Equations; Mathematical model; Predictive models; Soldering; Strain; Welding;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066961
