Title :
Interconnect simulation based on passivity and method of characteristics
Author :
Kuh, E.S. ; Mao, J.E. ; Wang, M.L.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Abstract :
Interconnect analysis modeling, and simulation will play a major role in the future design of submicron IC and electronic packaging. Existing simulation methods by and large depend on convolution and the well-known Pade approximation of transcendental functions which characterize transmission lines. Unfortunately, Pade approximation does not guarantee stability. In this paper two methods are presented. One is based on using the concept of passivity, and the other uses the traditional method of characteristics. Preliminary results obtained on simple examples are very encouraging
Keywords :
Laplace transforms; VLSI; circuit analysis computing; digital simulation; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; electronic packaging; interconnect simulation; method of characteristics; passivity; simulation methods; submicron IC; Analytical models; Computational modeling; Convolution; Delay; Integrated circuit interconnections; Integrated circuit modeling; Polynomials; Power transmission lines; Propagation losses; Stability;
Conference_Titel :
Circuits and Systems, 1996., IEEE Asia Pacific Conference on
Conference_Location :
Seoul
Print_ISBN :
0-7803-3702-6
DOI :
10.1109/APCAS.1996.569311
