Title :
SOP package surface discoloration after PCT test
Author :
Wang, Mu-Chun ; Yang, Hsin-Chia ; Liu, Chuan-Hsi ; Yang, Ren-Hau
Author_Institution :
Dept. of Electron. Eng., Minghsin Univ. of Sci. & Technol., Hsinchu, Taiwan
Abstract :
Although the new assembly technology is developed well in this recent era, the conventional surface mount package technology such as dual-side small-outline package (SOP) is still useful to the common commercial IC products. If the IC products will be delivered to the market, they must pass the reliability tests such as the pressure cook test (PCT). Unfortunately, some tested products depicted an outlook of metal migration on the surface of the packaged ICs after this product reliability test. The stressed ICs with discoloration showed a function fail.
Keywords :
integrated circuit packaging; integrated circuit reliability; integrated circuit testing; surface mount technology; IC products; PCT test; SOP package surface discoloration; assembly technology; dual side small outline package; metal migration; pressure cook test; product reliability test; reliability tests; surface mount package technology; Conferences; Electronic components; Electronics packaging; Integrated circuits; Materials; Packaging; Tin;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066964
