DocumentCode
2187265
Title
Direct production of conductive/resistive traces on a flexible substrate using a computer/printer system
Author
Sherman, Paul S.
Author_Institution
Dept. of Eng., Arkansas State Univ., AK, USA
Volume
2
fYear
1995
fDate
8-12 Oct 1995
Firstpage
1817
Abstract
Currently, strain gage instrumentation of rocket motor cases involves individually attaching each gage and running lengthy lead wires from the gages to the signal conditioning equipment. The application of many individual gages is time consuming. Also, the lead wires introduce errors due to their resistance and the electrical noise they absorb. Two areas of interest have been identified which deal with simultaneously applying multiple strain gages and locating the signal conditioning circuitry adjacent to the gages. Both of these areas of interest involve the production of conductive and resistive traces on flexible substrates. It is desired to produce these traces directly using computer control without having to use a silk screening process or etching of copper. The objectives of this study were to: (1) identify technologies which potentially could be developed to produce resistive strain gages and conductive traces for electronic circuitry on thin flexible substrates; (2) determine the current capabilities of these technologies as they pertain to the production of conductive and resistive traces; and (3) investigate the technologies to determine the problems which must be overcome in order to produce consistent and reliable results. Although control and timing difficulties present a problem with producing uniform traces, resistances of less than 0.4 Ω/cm (1 Ω/in) were produced with a width of about 1.0 mm (0.04 in)
Keywords
computerised instrumentation; conducting materials; electric sensing devices; foils; ink jet printers; process control; strain gauges; strain measurement; strain sensors; substrates; 0.04 in; 1 mm; computer control; conductive/resistive traces; electronic circuitry; resistances; resistive strain gage instrumentation; resistive traces; signal conditioning equipment; thin flexible substrate; timing difficulties; Capacitive sensors; Circuit noise; Electric resistance; Etching; Instruments; Joining processes; Production; Rockets; Signal processing; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Industry Applications Conference, 1995. Thirtieth IAS Annual Meeting, IAS '95., Conference Record of the 1995 IEEE
Conference_Location
Orlando, FL
ISSN
0197-2618
Print_ISBN
0-7803-3008-0
Type
conf
DOI
10.1109/IAS.1995.530526
Filename
530526
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