DocumentCode :
2187364
Title :
A stress-related model for reliability lifetime estimation of ACA joints based on accelerated failure date
Author :
Wu, Guanghua ; Tao, Bo
Author_Institution :
State Key Lab. of Digital Manuf. Equip. & Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear :
2011
fDate :
8-11 Aug. 2011
Firstpage :
1
Lastpage :
5
Abstract :
The model based on the accelerating aging tests, such as 85°C/85%RH, are usually used to estimate the reliability and MTTF of ACA joints in their normal working condition. Experiences show that it will lead inaccurate results if the influence of temperature level on reliability degradation is not considered. In this paper, the effect of the temperature level (namely working stress, denoted by s) on reliability of ACA joints is studied based on several accelerated failure experiments, and the potential relationship between the temperature stress and the lifetime of joints is revealed. After that, a stress-related lifetime prediction model is proposed, by which the mechanical reliability and the mean-time-to-failure (MTTF) of joints, working under any temperature condition, can be estimated. Numerical calculations have been done, and the results show that the MTTF of joints differ greatly if they experience different working temperature. This paper presented an applicable solution to estimate ACA joints´ lifetime under actual working stress by use of accelerating aging tests.
Keywords :
ageing; conductive adhesives; failure (mechanical); joining processes; reliability; ACA joint reliability lifetime estimation; accelerated failure date; aging tests; anisotropic conductive adhesive; flip-chip bonding; mechanical reliability; stress-related lifetime prediction model; stress-related model; temperature stress; Accelerated aging; Data models; Joints; Life estimation; Reliability; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
Type :
conf
DOI :
10.1109/ICEPT.2011.6066977
Filename :
6066977
Link To Document :
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