• DocumentCode
    2187364
  • Title

    A stress-related model for reliability lifetime estimation of ACA joints based on accelerated failure date

  • Author

    Wu, Guanghua ; Tao, Bo

  • Author_Institution
    State Key Lab. of Digital Manuf. Equip. & Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China
  • fYear
    2011
  • fDate
    8-11 Aug. 2011
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    The model based on the accelerating aging tests, such as 85°C/85%RH, are usually used to estimate the reliability and MTTF of ACA joints in their normal working condition. Experiences show that it will lead inaccurate results if the influence of temperature level on reliability degradation is not considered. In this paper, the effect of the temperature level (namely working stress, denoted by s) on reliability of ACA joints is studied based on several accelerated failure experiments, and the potential relationship between the temperature stress and the lifetime of joints is revealed. After that, a stress-related lifetime prediction model is proposed, by which the mechanical reliability and the mean-time-to-failure (MTTF) of joints, working under any temperature condition, can be estimated. Numerical calculations have been done, and the results show that the MTTF of joints differ greatly if they experience different working temperature. This paper presented an applicable solution to estimate ACA joints´ lifetime under actual working stress by use of accelerating aging tests.
  • Keywords
    ageing; conductive adhesives; failure (mechanical); joining processes; reliability; ACA joint reliability lifetime estimation; accelerated failure date; aging tests; anisotropic conductive adhesive; flip-chip bonding; mechanical reliability; stress-related lifetime prediction model; stress-related model; temperature stress; Accelerated aging; Data models; Joints; Life estimation; Reliability; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4577-1770-3
  • Electronic_ISBN
    978-1-4577-1768-0
  • Type

    conf

  • DOI
    10.1109/ICEPT.2011.6066977
  • Filename
    6066977