Title :
The impact of wire bonding on the transmission performance of high-speed links in SiP
Author :
Kun, Yang ; Wei, Gao ; Zhihua, Li ; Lixi, Wan
Author_Institution :
Lab. 9, Inst. Of Microelectron., Beijing, China
Abstract :
Wire bonding is a primary method of making interconnection between an integrated circuit (IC) and a printed circuit board (PCB) during semiconductor device fabrication, which is generally considered as the most flexible and cost-effective interconnection technology, and is widely used in electric packaging. This paper focuses on the impedance mismatch problem caused by bonding wires. A variety of bonding wires with different characteristics in terms of diameter, loop span, loop height, and shape are studied in this paper. Additionally, the crosstalk between adjacent bonding wires is analyzed. All analysis is founded on the base of signal integrity theory and simulation with HFSS software.
Keywords :
integrated circuit interconnections; lead bonding; printed circuits; system-on-package; electric packaging; high-speed links; impedance mismatch; integrated circuit; loop height; loop span; printed circuit board; semiconductor device fabrication; signal integrity theory; system-in-package; transmission performance; wire bonding; Bonding; Crosstalk; Grounding; Impedance; Insertion loss; Integrated circuit modeling; Wires;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066978
