• DocumentCode
    2187464
  • Title

    Experimental modal analysis and shaking test of an absolute displacement sensor for suppression of high frequency dynamics

  • Author

    Uemoto, Takuya ; Kai, Takafumi ; Nakamura, Yoshihiko ; Wakui, S.

  • Author_Institution
    Grad. Sch. of Eng., Tokyo Univ. of Agric. & Technol., Koganei, Japan
  • fYear
    2013
  • fDate
    Feb. 27 2013-March 1 2013
  • Firstpage
    150
  • Lastpage
    155
  • Abstract
    In the field of vibration control, accelerometers are widely used as feedback sensors. However, it is desirable to use a velocity sensor or a displacement sensor without integral operators. Effects of damping and a skyhook spring are obtained by velocity and displacement feedback, respectively. Therefore, an absolute displacement sensor has proposed to be utilized as feedback sensors of semiconductor exposure apparatuses. The proposed displacement sensor has the same mechanical structured having a detector and pendulum as a commercial velocity sensor. In previous works, the proposed sensor is applied as feedback and feedforward sensors. However, detection bandwidth is limited due to mechanical resonances called high frequency dynamics. In this paper, causes of the resonances are identified and we carry out to suppress the resonances. At first, control structure and operating principle of the proposed sensor are described. Next, we carry out experimental modal analysis and suppress the resonances by using viscoelastic materials. Finally, we try addition of mass damper in consideration of vibration mode and suppress the same resonances, which are appeared in shaking test.
  • Keywords
    accelerometers; damping; modal analysis; shock absorbers; vibration control; viscoelasticity; absolute displacement sensor; accelerometers; control structure; damping; detection bandwidth; detector; displacement feedback; displacement sensor; experimental modal analysis; feedback sensors; high-frequency dynamic suppression; mass damper; mechanical resonances; pendulum; resonance suppression; semiconductor exposure apparatuses; shaking test; skyhook spring; velocity sensor; vibration control; vibration mode; viscoelastic materials; Coils; Materials; Metals; Modal analysis; Resonant frequency; Shock absorbers; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronics (ICM), 2013 IEEE International Conference on
  • Conference_Location
    Vicenza
  • Print_ISBN
    978-1-4673-1386-5
  • Electronic_ISBN
    978-1-4673-1387-2
  • Type

    conf

  • DOI
    10.1109/ICMECH.2013.6518527
  • Filename
    6518527