DocumentCode
2187522
Title
Drop impact test on high power light emitting diodes module
Author
Peng, Tao ; Wang, Xuefang ; Chen, Mingxiang ; Chen, Run ; Liu, Sheng
Author_Institution
Sch. of Mech. Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear
2011
fDate
8-11 Aug. 2011
Firstpage
1
Lastpage
4
Abstract
In this study, reliability performances of high power light emitting diodes module subjected to drop test conditions are evaluated experimentally. Firstly, we have a theoretical analysis of the impact dynamic progress for the LED module. Secondly, a series of impact tests for LED module are also carried out by a self-made microelectronic drop tester. The good reproducibility of dynamic parameters such as impact force, and acceleration as a function of time are recorded for evaluating the impact response through the signal processing. Finally, we can conclude that the theoretical analysis is effective and the self-made drop tester is relatively precise by comparing the theoretical and experimental results. The main failure modes of LED module are lens off and crack formation in the impact experiment. The failure mechanisms of LED modules are analyzed in order to guide the design of LED light package modules.
Keywords
cracks; impact testing; light emitting diodes; light sources; crack formation; drop impact test condition; high power LED module; high power light emitting diode module; impact dynamic progress; light source; reliability performance; self-made microelectronic drop tester; signal processing; Acceleration; Dynamics; Fixtures; Force; Lenses; Light emitting diodes; Reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4577-1770-3
Electronic_ISBN
978-1-4577-1768-0
Type
conf
DOI
10.1109/ICEPT.2011.6066982
Filename
6066982
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