• DocumentCode
    2187598
  • Title

    Prognostics and reliability assessment of light emitting diode packaging

  • Author

    Sutharssan, Thamo ; Bailey, Chris ; Stoyanov, Stoyan ; Rosunally, Yasmine

  • Author_Institution
    Comput. Mech. & Reliability Group, Univ. of Greenwich, London, UK
  • fYear
    2011
  • fDate
    8-11 Aug. 2011
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Compared to the traditional light sources, applications of LED lights are continuously increasing as they have many advantages including high reliability, greater energy efficiency, long life time, small in size, and faster switching speed. Even though LEDs have high reliability and long life time, manufacturers and lighting systems designers still need to assess the reliability of LED lighting systems and the failures in the LED. This is very important with respect to the maintainability of the LED lighting systems after the deployment. In particular assessing the reliability of the LED lighting systems which are used for safety critical and emergency applications is a requirement to ensure the light output meets the standards all the time. This paper investigates distance measure techniques for a real-time prognostics system which can assess the reliability, predict the failure in advance and estimate remaining useful life time of a LED packaging. In particular Euclidean and Mahalanobis distance measure techniques are used to measure the degradation in the light output of the LEDs and used to predict the failure in advance. LEDs are tested under accelerated voltage conditions to collect the training and test data sets. Results show that both distance measure techniques predict the degradation in the light output. Simple linear state extrapolation technique is used to estimate the remaining useful life time of the LEDs, based on these two distance measure techniques.
  • Keywords
    electronics packaging; light emitting diodes; reliability; accelerated voltage conditions; energy efficiency; light emitting diode packaging; light sources; prognostics; reliability assessment; Current measurement; Light emitting diodes; Lighting; Monitoring; P-n junctions; Temperature measurement; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4577-1770-3
  • Electronic_ISBN
    978-1-4577-1768-0
  • Type

    conf

  • DOI
    10.1109/ICEPT.2011.6066984
  • Filename
    6066984