Title :
Cathode spots dynamics on pure metals and composite materials in high-current vacuum arcs
Author :
Chaly, A.M. ; Logatche, A.A. ; Shkol´nik, S.M.
Author_Institution :
Tavrida Electr. Ltd., Moscow, Russia
Abstract :
An investigation has been carried out of cathode spot dynamics in a triggered vacuum arc. A rectangular pulse, amplitude (1-5) kA, and duration of up to 5 ms has been used. Sufficient statistics were collected. The expansion of a cathode spot ring on a clean pure metal surface was corroborated to be a retrograde movement in the self magnetic field which obeys the same law as the movement of a single cathode spot in an external transversal magnetic field. The influence of a contact gap (0.5-8) mm and current on the dynamics of cathode spots was investigated. The distinctions between cathode processes on pure metals and composite materials were studied. A phenomenon was discovered, where a group of cathode spots form in the short arcs on the CuCr cathodes. The follow-up investigation revealed that an interrelation exists between cathode and anode processes in short arcs. The qualitative explanation of the phenomena observed is presented
Keywords :
anodes; cathodes; chromium alloys; copper; copper alloys; electron field emission; magnetic fields; stainless steel; tungsten alloys; vacuum arcs; 0.5 to 0.8 mm; 1 to 5 kA; 5 ms; Cu; CuCr50W3; CuCr50W3 cathodes; CuW70; CuW70 cathodes; anode processes; cathode processes; cathode spot ring expansion; cathode spots dynamics; clean pure metal surface; composite materials; contact gap; copper cathodes; high-current vacuum arcs; pure metals; rectangular pulse; self magnetic field; short arcs; stainless steel cathodes; triggered vacuum arc; Cathodes; Composite materials; Copper; Magnetic field measurement; Magnetic fields; Magnetic materials; Plasma density; Plasma materials processing; Plasma sources; Vacuum arcs;
Conference_Titel :
Discharges and Electrical Insulation in Vacuum, 1996. Proceedings. ISDEIV., XVIIth International Symposium on
Conference_Location :
Berkeley, CA
Print_ISBN :
0-7803-2906-6
DOI :
10.1109/DEIV.1996.545334