DocumentCode :
2187727
Title :
Crosstalk analysis and optimization of high-speed interconnections
Author :
Wang, Haidong ; Song, Jian ; Liu, Fengman ; Xiang, Haifei ; Gao, Wei ; Wan, Lixi
Author_Institution :
Inst. of Microelectron., Beijing, China
fYear :
2011
fDate :
8-11 Aug. 2011
Firstpage :
1
Lastpage :
4
Abstract :
Crosstalk noise has become a major performance inhibitor in high speed digital system. This is especially the case in package designs, connector assemblies and circuit interconnects designs. With the simultaneous miniaturization of electronic systems and decreasing signal rise time, it is important to be able to predict major sources of crosstalk and to stay within the cross-talk budget for high-speed interconnects interfaces. In this paper, first, we focus on analyzing the crosstalk mechanism. Second, based on simulation, we propose methods to minimize crosstalk.
Keywords :
integrated circuit design; integrated circuit interconnections; integrated circuit packaging; optimisation; circuit interconnects designs; connector assembly; cross-talk budget; crosstalk analysis; electronic systems; high speed digital system; high-speed interconnection optimization; high-speed interconnects interfaces; package designs; Couplings; Crosstalk; Dielectric constant; Integrated circuit interconnections; Integrated circuit modeling; Software; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
Type :
conf
DOI :
10.1109/ICEPT.2011.6066989
Filename :
6066989
Link To Document :
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