An advanced high speed solder ball impact method and its operation system

Author

Zhang, Yanbo ; Zhang, Zheming ; Chen, Haibin ; Mclellan, Neil ; Wu, Jingshen

Author_Institution

Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Hong Kong, China

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

6

Abstract

An advanced high speed solder ball impact tester (BIT) was developed together with its operation system based on the industrial demand of solder joint reliability tests. Different from the previous approaches, by applying some novel mechanical and software designs, this unique BIT system is able to perform precise high speed solder ball impact tests and automatic data analysis to fulfill the users´ requirements. In this work, the methods that this BIT system used to overcome existing problems in former BIT designs are introduced. The performance of the BIT has been evaluated in the impact tests on SAC105 and SAC305 solder joints. By utilizing this BIT, ram height changes without violating the JEDEC´s standards is proved to be trivial for SAC305 solder joint under high speed impact.

Keywords

data analysis; impact testing; reliability; solders; JEDEC standard; SAC105 solder joint; SAC305 solder joint; advanced high speed solder BIT method; advanced high speed solder ball impact tester method; automatic data analysis; solder joint reliability testing; Data acquisition; Electronics packaging; Force; Random access memory; Reliability; Soldering; Transducers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066992

Filename

6066992